I am afraid you are trying to compare an absolutely static device with single flat surface and maximum thermal contact to a complex machine with irregular shapes, moving at fast speed and constantly influenced by accelerations in all three planes.CBeck113 wrote:Here's some Information from Sapphire Technology, a graphic card maker and afaik the first to implement vapor cooling:
.......................
The greatest advantage of this system is that it requires no help to work, it starts and runs on thermodynamics =D>. Forced air flow is necessary, however, so it isn't completely free.
Electronic chips cooling systems use either gravitational or osmotic (wick) principle for returning the liquid phase back to the heat source. I for one can't imagine how it can be achieved for an ICE with the same simplicity and efficiency.